UPD70F3441F1(A2)-JA1-A Renesas Electronics Corporation

Description: PHOENIX-FS_DEVICE_DEVELOPMENT, Packaging: Tray, Package / Case: 357-LFBGA, Mounting Type: Surface Mount, Speed: 128MHz, Program Memory Size: 992KB (992K x 8), RAM Size: 60K x 8, Operating Temperature: -40°C ~ 125°C (TA), Program Memory Type: FLASH, EEPROM Size: 32K x 8, Core Processor: V850E1, Data Converters: A/D 20x10b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V, 3V ~ 3.6V, Connectivity: CANbus, CSIO, FlexRay, UART/USART, Peripherals: DMA, PWM, RNG, WDT, Supplier Device Package: 357-LFBGA (20x20), Number of I/O: 143.