Produkte > SAMTEC INC. > TSW-150-15-G-D

TSW-150-15-G-D Samtec Inc.


TSW-150-15-G-D Hersteller: Samtec Inc.
Description: CLASSIC PCB HEADER STRIPS, 0.100
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 100
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.730" (18.54mm)
Insulation Material: Polybutylene Terephthalate (PBT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.520" (13.21mm)
auf Bestellung 3251 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.57 EUR
10+ 17.35 EUR
100+ 15.12 EUR
1000+ 11.83 EUR
Produktrezensionen
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Technische Details TSW-150-15-G-D Samtec Inc.

Description: CLASSIC PCB HEADER STRIPS, 0.100, Packaging: Bulk, Connector Type: Header, Mounting Type: Through Hole, Number of Positions: 100, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Contact Shape: Square, Contact Length - Post: 0.110" (2.79mm), Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Overall Contact Length: 0.730" (18.54mm), Insulation Material: Polybutylene Terephthalate (PBT), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.520" (13.21mm).

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