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TLV2774AIN Texas Instruments
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Description: IC CMOS 4 CIRCUIT 14DIP
Packaging: Bulk
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: CMOS
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 1mA (x4 Channels)
Slew Rate: 10.5V/µs
Gain Bandwidth Product: 5.1 MHz
Current - Input Bias: 2 pA
Voltage - Input Offset: 700 µV
Supplier Device Package: 14-PDIP
Number of Circuits: 4
Current - Output / Channel: 50 mA
Voltage - Supply Span (Min): 2.5 V
Voltage - Supply Span (Max): 5.5 V
auf Bestellung 17790 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
94+ | 5.2 EUR |
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Technische Details TLV2774AIN Texas Instruments
Description: IC CMOS 4 CIRCUIT 14DIP, Packaging: Bulk, Package / Case: 14-DIP (0.300", 7.62mm), Output Type: Rail-to-Rail, Mounting Type: Through Hole, Amplifier Type: CMOS, Operating Temperature: -40°C ~ 125°C (TA), Current - Supply: 1mA (x4 Channels), Slew Rate: 10.5V/µs, Gain Bandwidth Product: 5.1 MHz, Current - Input Bias: 2 pA, Voltage - Input Offset: 700 µV, Supplier Device Package: 14-PDIP, Number of Circuits: 4, Current - Output / Channel: 50 mA, Voltage - Supply Span (Min): 2.5 V, Voltage - Supply Span (Max): 5.5 V.
Weitere Produktangebote TLV2774AIN nach Preis ab 4.88 EUR bis 9.72 EUR
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TLV2774AIN | Hersteller : Texas Instruments |
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auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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TLV2774AIN |
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auf Bestellung 890 Stücke: Lieferzeit 21-28 Tag (e) |
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TLV2774AIN | Hersteller : Texas Instruments |
![]() Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: Rail-to-Rail Mounting Type: Through Hole Amplifier Type: CMOS Operating Temperature: -40°C ~ 125°C (TA) Current - Supply: 1mA (x4 Channels) Slew Rate: 10.5V/µs Gain Bandwidth Product: 5.1 MHz Current - Input Bias: 2 pA Voltage - Input Offset: 700 µV Supplier Device Package: 14-PDIP Number of Circuits: 4 Current - Output / Channel: 50 mA Voltage - Supply Span (Min): 2.5 V Voltage - Supply Span (Max): 5.5 V |
Produkt ist nicht verfügbar |