TLP2309(TPR,E

TLP2309(TPR,E Toshiba Semiconductor and Storage


Hersteller: Toshiba Semiconductor and Storage
Description: X36 PB-F HIGH SPEED LOGIC OUTPUT
Packaging: Cut Tape (CT)
Package / Case: 6-SOIC (0.179", 4.55mm Width), 5 Leads
Output Type: Transistor
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 110°C
Voltage - Forward (Vf) (Typ): 1.55V
Input Type: DC
Current - Output / Channel: 8mA
Voltage - Isolation: 3750Vrms
Current Transfer Ratio (Min): 15% @ 16mA
Supplier Device Package: 6-SO, 5 Lead
Voltage - Output (Max): 20V
Turn On / Turn Off Time (Typ): 1µs, 1µs (Max)
Part Status: Active
Number of Channels: 1
Current - DC Forward (If) (Max): 25 mA
auf Bestellung 2788 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+2.04 EUR
14+ 1.29 EUR
100+ 0.95 EUR
500+ 0.88 EUR
1000+ 0.72 EUR
Mindestbestellmenge: 9
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Technische Details TLP2309(TPR,E Toshiba Semiconductor and Storage

Description: X36 PB-F HIGH SPEED LOGIC OUTPUT, Packaging: Tape & Reel (TR), Package / Case: 6-SOIC (0.179", 4.55mm Width), 5 Leads, Output Type: Transistor, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 110°C, Voltage - Forward (Vf) (Typ): 1.55V, Input Type: DC, Current - Output / Channel: 8mA, Voltage - Isolation: 3750Vrms, Current Transfer Ratio (Min): 15% @ 16mA, Supplier Device Package: 6-SO, 5 Lead, Voltage - Output (Max): 20V, Turn On / Turn Off Time (Typ): 1µs, 1µs (Max), Part Status: Active, Number of Channels: 1, Current - DC Forward (If) (Max): 25 mA.

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Packaging: Tape & Reel (TR)
Package / Case: 6-SOIC (0.179", 4.55mm Width), 5 Leads
Output Type: Transistor
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 110°C
Voltage - Forward (Vf) (Typ): 1.55V
Input Type: DC
Current - Output / Channel: 8mA
Voltage - Isolation: 3750Vrms
Current Transfer Ratio (Min): 15% @ 16mA
Supplier Device Package: 6-SO, 5 Lead
Voltage - Output (Max): 20V
Turn On / Turn Off Time (Typ): 1µs, 1µs (Max)
Part Status: Active
Number of Channels: 1
Current - DC Forward (If) (Max): 25 mA
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