THS7319IZSVR Texas Instruments
Hersteller: Texas Instruments
Description: IC AMP BUFFER 9UCSP
Packaging: Bulk
Package / Case: 9-XFBGA, CSPBGA
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Applications: Buffer
Slew Rate: 80V/µs
Voltage - Supply, Single/Dual (±): 2.5V ~ 5.5V
Supplier Device Package: 9-UCSP (1.5x1.5)
Number of Circuits: 3
Current - Supply: 3.4 mA
Current - Output / Channel: 70 mA
-3db Bandwidth: 20 MHz
Description: IC AMP BUFFER 9UCSP
Packaging: Bulk
Package / Case: 9-XFBGA, CSPBGA
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Applications: Buffer
Slew Rate: 80V/µs
Voltage - Supply, Single/Dual (±): 2.5V ~ 5.5V
Supplier Device Package: 9-UCSP (1.5x1.5)
Number of Circuits: 3
Current - Supply: 3.4 mA
Current - Output / Channel: 70 mA
-3db Bandwidth: 20 MHz
auf Bestellung 77500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 283+ | 1.72 EUR |
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Technische Details THS7319IZSVR Texas Instruments
Description: IC AMP BUFFER 9UCSP, Packaging: Tape & Reel (TR), Package / Case: 9-XFBGA, CSPBGA, Output Type: Rail-to-Rail, Mounting Type: Surface Mount, Applications: Buffer, Slew Rate: 80V/µs, Voltage - Supply, Single/Dual (±): 2.5V ~ 5.5V, Supplier Device Package: 9-UCSP (1.5x1.5), Number of Circuits: 3, Current - Supply: 3.4 mA, Current - Output / Channel: 70 mA, -3db Bandwidth: 20 MHz.
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auf Bestellung 2450 Stücke: Lieferzeit 21-28 Tag (e) |
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THS7319IZSVR | Hersteller : Texas Instruments |
Description: IC AMP BUFFER 9UCSP Packaging: Tape & Reel (TR) Package / Case: 9-XFBGA, CSPBGA Output Type: Rail-to-Rail Mounting Type: Surface Mount Applications: Buffer Slew Rate: 80V/µs Voltage - Supply, Single/Dual (±): 2.5V ~ 5.5V Supplier Device Package: 9-UCSP (1.5x1.5) Number of Circuits: 3 Current - Supply: 3.4 mA Current - Output / Channel: 70 mA -3db Bandwidth: 20 MHz |
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| THS7319IZSVR | Hersteller : Texas Instruments |
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