TFM-107-02-S-D-LC Samtec
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 10.16 EUR |
10+ | 9.31 EUR |
94+ | 8.11 EUR |
282+ | 5.93 EUR |
517+ | 5.28 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TFM-107-02-S-D-LC Samtec
Description: CONN HEADER SMD 14POS 1.27MM, Packaging: Tube, Features: Board Lock, Connector Type: Header, Voltage Rating: 275VAC, Current Rating (Amps): 2.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 14, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.131" (3.33mm).
Weitere Produktangebote TFM-107-02-S-D-LC nach Preis ab 7.03 EUR bis 10.33 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TFM-107-02-S-D-LC | Hersteller : Samtec Inc. |
Description: CONN HEADER SMD 14POS 1.27MM Packaging: Tube Features: Board Lock Connector Type: Header Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 14 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.131" (3.33mm) |
auf Bestellung 794 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
TFM-107-02-S-D-LC | Hersteller : SAMTEC |
Description: SAMTEC - TFM-107-02-S-D-LC - Stiftleiste, Board-to-Board, Wire-to-Board, 1.27 mm, 2 Reihe(n), 14 Kontakt(e) tariffCode: 85366930 productTraceability: No Kontaktüberzug: 0 Kontaktanschluss: 0 rohsCompliant: YES Rastermaß: 0 Anzahl der Kontakte: 0 euEccn: NLR Steckverbindersysteme: 0 Anzahl der Reihen: 0 Kontaktmaterial: 0 Steckverbinderkragen: 0 hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: TFM SVHC: No SVHC (14-Jun-2023) |
auf Bestellung 3 Stücke: Lieferzeit 14-21 Tag (e) |