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TEA2376AT/1J NXP Semiconductors


TEA2376AT.pdf Hersteller: NXP Semiconductors
TEA2376AT/1J
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Technische Details TEA2376AT/1J NXP Semiconductors

Description: IC, Packaging: Tape & Reel (TR), Package / Case: 10-SOIC (0.154", 3.90mm Width), Mounting Type: Surface Mount, Operating Temperature: -25°C ~ 125°C (TJ), Voltage - Supply: 0V ~ 22V, Frequency - Switching: 25kHz ~ 300kHz, Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM), Supplier Device Package: 10-SO.

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TEA2376AT/1J TEA2376AT/1J Hersteller : NXP USA Inc. TEA2376AT.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
Produkt ist nicht verfügbar
TEA2376AT/1J TEA2376AT/1J Hersteller : NXP USA Inc. TEA2376AT.pdf Description: IC
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
Produkt ist nicht verfügbar