TC387QP160F300SADKXUMA1 Infineon Technologies
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Technische Details TC387QP160F300SADKXUMA1 Infineon Technologies
Description: IC MCU 32BIT 10MB FLASH 292LFBGA, Packaging: Tape & Reel (TR), Package / Case: 292-LFBGA, Mounting Type: Surface Mount, Speed: 300MHz, Program Memory Size: 10MB (10M x 8), RAM Size: 1.53K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: TriCore™, Core Size: 32-Bit Quad-Core, Voltage - Supply (Vcc/Vdd): 3.3V, 5V, Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT, Peripherals: DMA, I2S, PWM, WDT, Supplier Device Package: PG-LFBGA-292-11, Part Status: Obsolete, DigiKey Programmable: Not Verified.
Weitere Produktangebote TC387QP160F300SADKXUMA1
Foto | Bezeichnung | Hersteller | Beschreibung |
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TC387QP160F300SADKXUMA1 | Hersteller : Infineon Technologies | MCU 32-bit TriCore RISC 10MB Flash 3.3V/5V Automotive 292-Pin LFBGA T/R |
Produkt ist nicht verfügbar |
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TC387QP160F300SADKXUMA1 | Hersteller : Infineon Technologies |
Description: IC MCU 32BIT 10MB FLASH 292LFBGA Packaging: Tape & Reel (TR) Package / Case: 292-LFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 10MB (10M x 8) RAM Size: 1.53K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: TriCore™ Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: PG-LFBGA-292-11 Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |