SY89872UMG-TR Microchip Technology
auf Bestellung 1969 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 17.46 EUR |
| 10+ | 17.42 EUR |
| 25+ | 15.21 EUR |
| 100+ | 14.71 EUR |
| 1000+ | 14.7 EUR |
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Technische Details SY89872UMG-TR Microchip Technology
Description: IC CLK BUFFER 1:3 2GHZ 16MLF, Packaging: Tape & Reel (TR), Package / Case: 16-VFQFN Exposed Pad, 16-MLF®, Number of Circuits: 1, Mounting Type: Surface Mount, Output: LVDS, Type: Fanout Buffer (Distribution), Divider, Input: CML, HSTL, LVDS, LVPECL, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 2.375V ~ 2.625V, Ratio - Input:Output: 1:3, Differential - Input:Output: Yes/Yes, Supplier Device Package: 16-MLF® (3x3), Part Status: Active, Frequency - Max: 2 GHz.
Weitere Produktangebote SY89872UMG-TR nach Preis ab 17.86 EUR bis 23.58 EUR
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SY89872UMG-TR | Hersteller : Microchip Technology |
 Description: IC CLK BUFFER 1:3 2GHZ 16MLFPackaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad, 16-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVDS Type: Fanout Buffer (Distribution), Divider Input: CML, HSTL, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 2.625V Ratio - Input:Output: 1:3 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-MLF® (3x3) Part Status: Active Frequency - Max: 2 GHz |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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SY89872UMG-TR | Hersteller : Microchip Technology |
Description: IC CLK BUFFER 1:3 2GHZ 16MLF Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad, 16-MLF® Number of Circuits: 1 Mounting Type: Surface Mount Output: LVDS Type: Fanout Buffer (Distribution), Divider Input: CML, HSTL, LVDS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 2.625V Ratio - Input:Output: 1:3 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-MLF® (3x3) Part Status: Active Frequency - Max: 2 GHz |
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