Produkte > SAMTEC INC. > SSW-113-21-G-D-009

SSW-113-21-G-D-009 Samtec Inc.


Hersteller: Samtec Inc.
Description: CONN RCPT 26POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.7A per Contact
Mounting Type: Through Hole
Number of Positions: 26
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: 25
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.104" (2.64mm)
Insulation Height: 0.335" (8.51mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 167 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.76 EUR
Mindestbestellmenge: 3
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Technische Details SSW-113-21-G-D-009 Samtec Inc.

Description: CONN RCPT 26POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Current Rating (Amps): 4.7A per Contact, Mounting Type: Through Hole, Number of Positions: 26, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: 25, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Contact Length - Post: 0.104" (2.64mm), Insulation Height: 0.335" (8.51mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.

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