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SSM-115-S-DV-LC-K

SSM-115-S-DV-LC-K Samtec Inc.

ssm-1xx-xxx-dv-xx-xx-xxx-x-xx-mkt.pdf Hersteller: Samtec Inc.
Description: CONN RCPT 30POS 0.1 GOLD SMD
Features: Board Lock, Pick and Place
Packaging: Tube
Connector Type: Receptacle, Pass Through
Voltage Rating: 405VAC, 572VDC
Current Rating (Amps): 5.2A per Contact
Mounting Type: Surface Mount
Number of Positions: 30
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Insulation Height: 0.290" (7.37mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.02 EUR
10+ 10.29 EUR
25+ 9.51 EUR
50+ 8.76 EUR
100+ 7.83 EUR
Mindestbestellmenge: 2
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Technische Details SSM-115-S-DV-LC-K Samtec Inc.

Description: CONN RCPT 30POS 0.1 GOLD SMD, Features: Board Lock, Pick and Place, Packaging: Tube, Connector Type: Receptacle, Pass Through, Voltage Rating: 405VAC, 572VDC, Current Rating (Amps): 5.2A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Insulation Height: 0.290" (7.37mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.

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