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SPC5746BK1AMMH2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
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Technische Details SPC5746BK1AMMH2 NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA, Packaging: Tray, Package / Case: 100-LFBGA, Mounting Type: Surface Mount, Speed: 120MHz, Program Memory Size: 3MB (3M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: e200z4, Data Converters: A/D 36x10b, 16x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V, Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, Peripherals: DMA, I²S, POR, WDT, Supplier Device Package: 100-MAPBGA (11x11), Part Status: Active, DigiKey Programmable: Not Verified.
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SPC5746BK1AMMH2 | Hersteller : NXP Semiconductors |
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