SPC5674FAMVV3R NXP USA Inc.
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Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
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Technische Details SPC5674FAMVV3R NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,, Packaging: Tape & Reel (TR), Package / Case: 516-BBGA, Mounting Type: Surface Mount, Speed: 264MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 256K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Program Memory Type: FLASH, Core Processor: e200z7, Data Converters: A/D 64x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V, Connectivity: CANbus, EBI/EMI, SCI, SPI, Peripherals: DMA, POR, PWM, Supplier Device Package: 516-PBGA (27x27), Number of I/O: 32.
Weitere Produktangebote SPC5674FAMVV3R
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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SPC5674FAMVV3R | Hersteller : NXP Semiconductors |
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