SPC5566MVR144R NXP Semiconductors
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MCU 32-bit e200 RISC 3MB Flash 1.8V/2.5V/3.3V/5V Automotive 416-Pin BGA T/R
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Technische Details SPC5566MVR144R NXP Semiconductors
Description: NXP 32-BIT MCU, POWER ARCH CORE,, Packaging: Tape & Reel (TR), Package / Case: 416-BBGA, Mounting Type: Surface Mount, Speed: 144MHz, Program Memory Size: 3MB (3M x 8), RAM Size: 128K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Program Memory Type: FLASH, Core Processor: e200z6, Data Converters: A/D 40x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V, Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 416-PBGA (27x27).
Weitere Produktangebote SPC5566MVR144R
Foto | Bezeichnung | Hersteller | Beschreibung |
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SPC5566MVR144R | Hersteller : NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 3MB (3M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) |
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SPC5566MVR144R | Hersteller : NXP Semiconductors |
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