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SN74AVCA406EZXYR Texas Instruments
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Description: IC TRANSLTR BIDIRECTIONAL 20BGA
Features: SIM Card Interface
Packaging: Bulk
Package / Case: 20-UFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-BGA Microstar Junior (2.5x3.0)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.2 V ~ 3.6 V
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 20848 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
290+ | 1.71 EUR |
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Technische Details SN74AVCA406EZXYR Texas Instruments
Description: IC TRANSLTR BIDIRECTIONAL 20BGA, Features: SIM Card Interface, Packaging: Tape & Reel (TR), Package / Case: 20-UFBGA, Output Type: Tri-State, Non-Inverted, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C (TA), Supplier Device Package: 20-BGA Microstar Junior (2.5x3.0), Channel Type: Bidirectional, Translator Type: Voltage Level, Channels per Circuit: 4, Voltage - VCCA: 1.2 V ~ 3.6 V, Voltage - VCCB: 1.2 V ~ 3.6 V, Part Status: Obsolete, Number of Circuits: 1.
Weitere Produktangebote SN74AVCA406EZXYR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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SN74AVCA406EZXYR | Hersteller : Texas Instruments |
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auf Bestellung 8187 Stücke: Lieferzeit 10-14 Tag (e) |
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SN74AVCA406EZXYR |
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auf Bestellung 2500 Stücke: Lieferzeit 21-28 Tag (e) |
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SN74AVCA406EZXYR | Hersteller : Texas Instruments |
![]() Features: SIM Card Interface Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-BGA Microstar Junior (2.5x3.0) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.2 V ~ 3.6 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
|
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SN74AVCA406EZXYR | Hersteller : Texas Instruments |
![]() Packaging: Cut Tape (CT) Features: SIM Card Interface Package / Case: 20-UFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-BGA Microstar Junior (2.5x3.0) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 4 Voltage - VCCA: 1.2 V ~ 3.6 V Voltage - VCCB: 1.2 V ~ 3.6 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |