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SEAFP-50-01-S-10-RA-WT

SEAFP-50-01-S-10-RA-WT Samtec Inc.

seafp-ra.pdf Hersteller: Samtec Inc.
Description: CONN HD ARRAY F 500POS P-FIT R/A
Packaging: Tray
Features: Solder Retention
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle, Press-Fit
Number of Positions: 500
Pitch: 0.050" (1.27mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 10
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Technische Details SEAFP-50-01-S-10-RA-WT Samtec Inc.

Description: CONN HD ARRAY F 500POS P-FIT R/A, Packaging: Tray, Features: Solder Retention, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Through Hole, Right Angle, Press-Fit, Number of Positions: 500, Pitch: 0.050" (1.27mm), Contact Finish Thickness: 30.0µin (0.76µm), Number of Rows: 10.

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