SEAFP-50-01-S-08-RA-WT Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY F 400POS P-FIT R/A
Features: Solder Retention
Packaging: Tray
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle, Press-Fit
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 8
Description: CONN HD ARRAY F 400POS P-FIT R/A
Features: Solder Retention
Packaging: Tray
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle, Press-Fit
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 8
auf Bestellung 204 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 73.76 EUR |
10+ | 69.84 EUR |
25+ | 67.22 EUR |
50+ | 65.58 EUR |
100+ | 52.37 EUR |
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Technische Details SEAFP-50-01-S-08-RA-WT Samtec Inc.
Description: CONN HD ARRAY F 400POS P-FIT R/A, Features: Solder Retention, Packaging: Tray, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Through Hole, Right Angle, Press-Fit, Number of Positions: 400, Pitch: 0.050" (1.27mm), Contact Finish Thickness: 30.0µin (0.76µm), Number of Rows: 8.
Weitere Produktangebote SEAFP-50-01-S-08-RA-WT
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
SEAFP-50-01-S-08-RA-WT | Hersteller : Samtec | Board to Board & Mezzanine Connectors .050" SEARAY High-Speed Open-Pin-Field Array Socket, Press-Fit |
Produkt ist nicht verfügbar |