SEAF-50-05.0-S-06-1-A-K-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN HD ARRAY RCPT 300P SMD GOLD
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 300
Pitch: 0.050" (1.27mm)
Height Above Board: 0.199" (5.05mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm, 11.5mm, 12mm, 14mm, 16mm, 18mm
Number of Rows: 6
Description: CONN HD ARRAY RCPT 300P SMD GOLD
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 300
Pitch: 0.050" (1.27mm)
Height Above Board: 0.199" (5.05mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 7mm, 8mm, 8.5mm, 11.5mm, 12mm, 14mm, 16mm, 18mm
Number of Rows: 6
auf Bestellung 124 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 36.31 EUR |
10+ | 31.8 EUR |
25+ | 30.42 EUR |
50+ | 29.44 EUR |
100+ | 28.46 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details SEAF-50-05.0-S-06-1-A-K-TR Samtec Inc.
Description: CONN HD ARRAY RCPT 300P SMD GOLD, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 300, Pitch: 0.050" (1.27mm), Height Above Board: 0.199" (5.05mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 7mm, 8mm, 8.5mm, 11.5mm, 12mm, 14mm, 16mm, 18mm, Number of Rows: 6.
Weitere Produktangebote SEAF-50-05.0-S-06-1-A-K-TR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
SEAF-50-05.0-S-06-1-A-K-TR | Hersteller : Samtec | Conn Open Pin Field Array SKT 300 POS 1.27mm Solder ST Top Entry SMD T/R |
Produkt ist nicht verfügbar |
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SEAF-50-05.0-S-06-1-A-K-TR | Hersteller : Samtec Inc. |
Description: CONN HD ARRAY RCPT 300P SMD GOLD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 300 Pitch: 0.050" (1.27mm) Height Above Board: 0.199" (5.05mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 7mm, 8mm, 8.5mm, 11.5mm, 12mm, 14mm, 16mm, 18mm Number of Rows: 6 |
Produkt ist nicht verfügbar |