SAM9X60-V/DWBVAO Microchip Technology
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Technische Details SAM9X60-V/DWBVAO Microchip Technology
Description: IC MPU SAM9X 600MHZ 228TFBGA, Packaging: Tray, Package / Case: 228-TFBGA, Mounting Type: Surface Mount, Speed: 600MHz, Operating Temperature: -40°C ~ 105°C (TA), Core Processor: ARM926EJ-S, Voltage - I/O: 1.8V, 3.3V, Supplier Device Package: 228-TFBGA (11x11), Ethernet: 10/100Mbps (2), USB: USB 2.0 (5), Number of Cores/Bus Width: 1 Core, 32-Bit, RAM Controllers: DDR2, LPDDR, LPSDR, SRAM, Graphics Acceleration: Yes, Display & Interface Controllers: Keyboard, LCD, Touchscreen, Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA, Part Status: Active, Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART.
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SAM9X60-V/DWBVAO | Hersteller : Microchip Technology |
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SAM9X60-V/DWBVAO | Hersteller : Microchip Technology |
![]() Packaging: Tray Package / Case: 228-TFBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 228-TFBGA (11x11) Ethernet: 10/100Mbps (2) USB: USB 2.0 (5) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR, LPSDR, SRAM Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, LCD, Touchscreen Security Features: Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins, TDES / AES / SHA Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART |
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