Technische Details S32M243CCABWKHSR NXP Semiconductors
Description: IC, Packaging: Tape & Reel (TR), Package / Case: 64-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 32K x 8, Operating Temperature: -40°C ~ 150°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: ARM® Cortex®-M4F, Data Converters: A/D 6x12b SAR; D/A 1x8b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V, Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT, Supplier Device Package: 64-LQFP (10x10), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote S32M243CCABWKHSR
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S32M243CCABWKHSR | Hersteller : NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 6x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
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