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S1C17W04F102100 Epson Electronics America Inc-Semiconductor Div
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Description: IC MCU 16BIT 32KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 4.2MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S1C17
Data Converters: A/D 6x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
Connectivity: I2C, IrDA, SSI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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Technische Details S1C17W04F102100 Epson Electronics America Inc-Semiconductor Div
Description: IC MCU 16BIT 32KB FLASH 48TQFP, Packaging: Tray, Package / Case: 48-TQFP, Mounting Type: Surface Mount, Speed: 4.2MHz, Program Memory Size: 32KB (32K x 8), RAM Size: 2K x 8, Operating Temperature: -40°C ~ 85°C, Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: S1C17, Data Converters: A/D 6x12b SAR, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V, Connectivity: I2C, IrDA, SSI, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 48-TQFP (7x7), Number of I/O: 34, DigiKey Programmable: Not Verified.
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