QTS-032-03-F-D-DP-LC Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P SMD GOLD
Packaging: Tray
Features: Board Lock, Ground Bus (Plane)
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.404" (10.27mm)
Contact Finish Thickness: 3.00µin (0.076µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
Description: CONN DIFF ARRAY PLG 64P SMD GOLD
Packaging: Tray
Features: Board Lock, Ground Bus (Plane)
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 64
Pitch: 0.025" (0.64mm)
Height Above Board: 0.404" (10.27mm)
Contact Finish Thickness: 3.00µin (0.076µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
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Technische Details QTS-032-03-F-D-DP-LC Samtec Inc.
Description: CONN DIFF ARRAY PLG 64P SMD GOLD, Packaging: Tray, Features: Board Lock, Ground Bus (Plane), Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 64, Pitch: 0.025" (0.64mm), Height Above Board: 0.404" (10.27mm), Contact Finish Thickness: 3.00µin (0.076µm), Mated Stacking Heights: 11mm, Number of Rows: 2.
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