QTE-028-01-H-D-DP-A-K-TR Samtec Inc.
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Description: CONN DIFF ARRAY PLG 56P SMD GOLD
Packaging: Cut Tape (CT)
Features: Board Guide, Ground Bus (Plane), Pick and Place
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 0.168" (4.27mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm
Part Status: Active
Number of Rows: 2
auf Bestellung 275 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 31.13 EUR |
10+ | 29.46 EUR |
25+ | 28.35 EUR |
50+ | 27.67 EUR |
100+ | 21.2 EUR |
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Technische Details QTE-028-01-H-D-DP-A-K-TR Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Ground Bus (Plane), Pick and Place, Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 56, Pitch: 0.031" (0.80mm), Height Above Board: 0.168" (4.27mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote QTE-028-01-H-D-DP-A-K-TR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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QTE-028-01-H-D-DP-A-K-TR | Hersteller : Samtec |
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Produkt ist nicht verfügbar |
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QTE-028-01-H-D-DP-A-K-TR | Hersteller : Samtec Inc. |
![]() Packaging: Tape & Reel (TR) Features: Board Guide, Ground Bus (Plane), Pick and Place Connector Type: Differential Pair Array, Male Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 56 Pitch: 0.031" (0.80mm) Height Above Board: 0.168" (4.27mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 5mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |