QMS-016-01-H-D-DP-RA-MG Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P R/A GOLD
Packaging: Tray
Features: Ground Bus (Plane), Mating Guide
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle; Through Hole
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Height Above Board: 0.320" (8.12mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
Description: CONN DIFF ARRAY PLG 32P R/A GOLD
Packaging: Tray
Features: Ground Bus (Plane), Mating Guide
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount, Right Angle; Through Hole
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Height Above Board: 0.320" (8.12mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 2
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Technische Details QMS-016-01-H-D-DP-RA-MG Samtec Inc.
Description: CONN DIFF ARRAY PLG 32P R/A GOLD, Packaging: Tray, Features: Ground Bus (Plane), Mating Guide, Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Right Angle; Through Hole, Number of Positions: 32, Pitch: 0.025" (0.64mm), Height Above Board: 0.320" (8.12mm), Contact Finish Thickness: 30.0µin (0.76µm), Number of Rows: 2.
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QMS-016-01-H-D-DP-RA-MG | Hersteller : Samtec |
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