QFSS-016-04.25-H-D-DP-PC4-P Samtec Inc.
Hersteller: Samtec Inc.
Description: .635MM DOUBLE ROW SHIELDED TERMI
Packaging: Bulk
Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40 (32 + 8 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
Description: .635MM DOUBLE ROW SHIELDED TERMI
Packaging: Bulk
Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40 (32 + 8 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
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Technische Details QFSS-016-04.25-H-D-DP-PC4-P Samtec Inc.
Description: .635MM DOUBLE ROW SHIELDED TERMI, Packaging: Bulk, Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 40 (32 + 8 Power), Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 11mm, Number of Rows: 2.
Weitere Produktangebote QFSS-016-04.25-H-D-DP-PC4-P
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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QFSS-016-04.25-H-D-DP-PC4-P | Hersteller : Samtec |
 Board to Board & Mezzanine Connectors 0.635 mm pitch (.025"), 96 positions, differential pair signaling |
Produkt ist nicht verfügbar |