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MSCDC300A70AG

MSCDC300A70AG Microchip Technology


1244350-mscdc300a70ag-datasheet Hersteller: Microchip Technology
Description: DIODE MOD SIC SCHOTT 700V SP6
Packaging: Tube
Package / Case: Module
Mounting Type: Chassis Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 300A
Supplier Device Package: SP6
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A
Current - Reverse Leakage @ Vr: 1.2 mA @ 700 V
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Technische Details MSCDC300A70AG Microchip Technology

Description: DIODE MOD SIC SCHOTT 700V SP6, Packaging: Tube, Package / Case: Module, Mounting Type: Chassis Mount, Speed: No Recovery Time > 500mA (Io), Reverse Recovery Time (trr): 0 ns, Technology: SiC (Silicon Carbide) Schottky, Diode Configuration: 1 Pair Series Connection, Current - Average Rectified (Io) (per Diode): 300A, Supplier Device Package: SP6, Operating Temperature - Junction: -40°C ~ 175°C, Voltage - DC Reverse (Vr) (Max): 700 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 300 A, Current - Reverse Leakage @ Vr: 1.2 mA @ 700 V.

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MSCDC300A70AG Hersteller : MICROCHIP (MICROSEMI) 1244350-mscdc300a70ag-datasheet MSCDC300A70AG Diode modules
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MSCDC300A70AG MSCDC300A70AG Hersteller : Microchip Technology Microsemi_MSCDC300A70AG_Datasheet-3444433.pdf Discrete Semiconductor Modules PM-DIODE-SIC-SBD-SP6C
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MSCDC300A70AG Hersteller : MICROCHIP TECHNOLOGY 1244350-mscdc300a70ag-datasheet Category: Diode modules
Description: Module: diode; double series; 700V; 300A; SP6C; screw; screw; SiC
Case: SP6C
Electrical mounting: screw
Mechanical mounting: screw
Type of module: diode
Features of semiconductor devices: Schottky
Technology: SiC
Max. off-state voltage: 700V
Load current: 300A
Semiconductor structure: double series
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