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MS-DIP/SMD5
Hersteller:
Category: Universal PCBs
Description: Board: universal; single sided,prototyping; W: 60mm; L: 80mm
Width: 60mm
Material: epoxy resin; FR4
Hole diameter: 1mm
Length: 80mm
Laminate thickness: 1mm
Copper plating thickness: 18µm
Type of board: universal
Soldering pads configuration: 0805; 1206; MELF; SMA; SMB; SMC; SO8; SO10; SO14; SO16; SO18; SO20; SO24; SO28; SOD80; SOD87; SOT23; SOT89; SOT143; SOT223; SOT323
Soldering pads pitch: 0.7/2.54mm
Board variant: prototyping; single sided
Kind of material: fiber glass reinforced
Category: Universal PCBs
Description: Board: universal; single sided,prototyping; W: 60mm; L: 80mm
Width: 60mm
Material: epoxy resin; FR4
Hole diameter: 1mm
Length: 80mm
Laminate thickness: 1mm
Copper plating thickness: 18µm
Type of board: universal
Soldering pads configuration: 0805; 1206; MELF; SMA; SMB; SMC; SO8; SO10; SO14; SO16; SO18; SO20; SO24; SO28; SOD80; SOD87; SOT23; SOT89; SOT143; SOT223; SOT323
Soldering pads pitch: 0.7/2.54mm
Board variant: prototyping; single sided
Kind of material: fiber glass reinforced
auf Bestellung 17 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
11+ | 7.09 EUR |
14+ | 5.31 EUR |
15+ | 5.02 EUR |
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Technische Details MS-DIP/SMD5
Category: Universal PCBs, Description: Board: universal; single sided,prototyping; W: 60mm; L: 80mm, Width: 60mm, Material: epoxy resin; FR4, Hole diameter: 1mm, Length: 80mm, Laminate thickness: 1mm, Copper plating thickness: 18µm, Type of board: universal, Soldering pads configuration: 0805; 1206; MELF; SMA; SMB; SMC; SO8; SO10; SO14; SO16; SO18; SO20; SO24; SO28; SOD80; SOD87; SOT23; SOT89; SOT143; SOT223; SOT323, Soldering pads pitch: 0.7/2.54mm, Board variant: prototyping; single sided, Kind of material: fiber glass reinforced, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote MS-DIP/SMD5 nach Preis ab 5.02 EUR bis 7.09 EUR
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MS-DIP/SMD5 |
Category: Universal PCBs Description: Board: universal; single sided,prototyping; W: 60mm; L: 80mm Width: 60mm Material: epoxy resin; FR4 Hole diameter: 1mm Length: 80mm Laminate thickness: 1mm Copper plating thickness: 18µm Type of board: universal Soldering pads configuration: 0805; 1206; MELF; SMA; SMB; SMC; SO8; SO10; SO14; SO16; SO18; SO20; SO24; SO28; SOD80; SOD87; SOT23; SOT89; SOT143; SOT223; SOT323 Soldering pads pitch: 0.7/2.54mm Board variant: prototyping; single sided Kind of material: fiber glass reinforced Anzahl je Verpackung: 1 Stücke |
auf Bestellung 17 Stücke: Lieferzeit 7-14 Tag (e) |
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MS-DIP/SMD5 Produktcode: 124741 |
Hersteller : MAJ-STAR |
Steckbretter > Experimentierplatinen (Leiterplatten) Габарити: 80x60мм Опис: Макетная плата для: SO8 - SO28S и дискретных элементов 0805, 1206, SOT23, SOT89, SOT143, SOT223, SOT323, SOD80, SOD87, MELF, SMA, SMB, SMC, танталовые конденсаторы типа: А, В, С и D Тип: Макетная плата под пайку Вид: Односторонняя |
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