MPF5024AMBA0ESR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MPF5024AMBA0ESR2 NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: High Performance i.MX 8, S32x Processor Based, Current - Supply: 10µA, Supplier Device Package: 40-HVQFN (6x6), Grade: Automotive, Qualification: AEC-Q100.
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MPF5024AMBA0ESR2 | Hersteller : NXP Semiconductors |
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