MFS2401AVMA0ESR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MFS2401AVMA0ESR2 NXP USA Inc.
Description: IC, Packaging: Bulk, Package / Case: 32-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 115°C (TA), Voltage - Supply: 5.5V ~ 40V, Applications: System Basis Chip, Supplier Device Package: 32-HVQFN (5x5), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote MFS2401AVMA0ESR2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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MFS2401AVMA0ESR2 | Hersteller : NXP Semiconductors | Power Management Specialised - PMIC Safety Mini CAN FD SBC for Automotive Applications Fit for ASIL-B |
Produkt ist nicht verfügbar |