MDF76GW-30S-1H(58) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 30P 0.039 GOLD SMD R/A
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 200VAC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 85°C
Contact Type: Center Strip Contact
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Gold
Insulation Height: 0.091" (2.30mm)
Number of Rows: 1
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Technische Details MDF76GW-30S-1H(58) Hirose Electric Co Ltd
Description: CONN RCPT 30P 0.039 GOLD SMD R/A, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 200VAC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 85°C, Contact Type: Center Strip Contact, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Gold, Insulation Height: 0.091" (2.30mm), Number of Rows: 1.
Weitere Produktangebote MDF76GW-30S-1H(58)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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MDF76GW-30S-1H(58) | Hersteller : Hirose Connector |
Power to the Board 30P F R/A RECEP SMT STANDARD TOP BOARD |
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