MCF54452CVP200 NXP USA Inc.
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Description: IC MCU 32BIT ROMLESS 360BGA
Packaging: Tray
Package / Case: 360-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
Connectivity: I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 360-BGA (23x23)
Number of I/O: 132
DigiKey Programmable: Not Verified
auf Bestellung 599 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 58.47 EUR |
10+ | 46.88 EUR |
80+ | 40.04 EUR |
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Technische Details MCF54452CVP200 NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 360BGA, Packaging: Tray, Package / Case: 360-BBGA, Mounting Type: Surface Mount, Speed: 200MHz, RAM Size: 32K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Internal, Program Memory Type: ROMless, Core Processor: Coldfire V4, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V, Connectivity: I2C, SPI, SSI, UART/USART, USB OTG, Peripherals: DMA, WDT, Supplier Device Package: 360-BGA (23x23), Number of I/O: 132, DigiKey Programmable: Not Verified.
Weitere Produktangebote MCF54452CVP200
Foto | Bezeichnung | Hersteller | Beschreibung |
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MCF54452CVP200 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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MCF54452CVP200 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |