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MC9S12XHZ256CAG NXP USA Inc.
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Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 117
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Technische Details MC9S12XHZ256CAG NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP, Packaging: Tray, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 16K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Program Memory Type: FLASH, EEPROM Size: 4K x 8, Core Processor: HCS12X, Data Converters: A/D 16x8/10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V, Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, SPI, Peripherals: LCD, Motor control PWM, POR, PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Part Status: Not For New Designs, Number of I/O: 117.
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MC9S12XHZ256CAG | Hersteller : NXP Semiconductors |
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