![MC9S12DG256VFUE MC9S12DG256VFUE](https://download.siliconexpert.com/pdfs/2017/7/13/6/27/16/504/phi_/manual/sot1103-3_3d.jpg)
MC9S12DG256VFUE NXP Semiconductors
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Technische Details MC9S12DG256VFUE NXP Semiconductors
Description: IC MCU 16BIT 256KB FLASH 80QFP, Packaging: Tray, Package / Case: 80-QFP, Mounting Type: Surface Mount, Speed: 25MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 12K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 4K x 8, Core Processor: HCS12, Data Converters: A/D 16x10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V, Connectivity: CANbus, I2C, SCI, SPI, Peripherals: PWM, WDT, Supplier Device Package: 80-QFP (14x14), Number of I/O: 59, DigiKey Programmable: Not Verified.
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MC9S12DG256VFUE | Hersteller : NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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