MC33PF3001A7ESR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
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Technische Details MC33PF3001A7ESR2 NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-, Packaging: Tape & Reel (TR), Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 2.8V ~ 5.5V, Applications: Processor, Supplier Device Package: 48-HVQFN (7x7), Part Status: Active.
Weitere Produktangebote MC33PF3001A7ESR2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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MC33PF3001A7ESR2 | Hersteller : NXP Semiconductors | Power Management Specialised - PMIC Power Management IC, i.MX7, pre-prog, 4 buck, 6 LDO, 1 boost, Auto, QFN 48 |
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