MC33907LAER2 NXP Semiconductors
Hersteller: NXP Semiconductors
Description: MC33907 - System Basis chip, DCD
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Description: MC33907 - System Basis chip, DCD
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
auf Bestellung 15950 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
35+ | 13.96 EUR |
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Technische Details MC33907LAER2 NXP Semiconductors
Description: MC33907 - System Basis chip, DCD, Packaging: Bulk, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 3.3V, 5V, Applications: System Basis Chip, Current - Supply: 3.5mA, Supplier Device Package: 48-LQFP (7x7), Grade: Automotive.
Weitere Produktangebote MC33907LAER2
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Verfügbarkeit |
Preis ohne MwSt |
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MC33907LAER2 | Hersteller : NXP Semiconductors | High Performance System Basis Chip IC |
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MC33907LAER2 | Hersteller : NXP Semiconductors | High Performance System Basis Chip |
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MC33907LAER2 | Hersteller : NXP Semiconductors | Power Management Specialised - PMIC System Basis chip, DCDC 1.5 A Vcore FS1b LDT, LQFP48EP, Tray |
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