Technische Details MC33665ATS4AER2 NXP Semiconductors
Description: HIGH SPEED TRANSCEIVER WITH SPI, Packaging: Tape & Reel (TR), Package / Case: 48-LQFP Exposed Pad, Number of Cells: 1, Mounting Type: Surface Mount, Function: Power Management, Interface: I2C, SPI, Operating Temperature: -40°C ~ 125°C (TA), Supplier Device Package: 48-HLQFP (7x7), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote MC33665ATS4AER2
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| MC33665ATS4AER2 | Hersteller : NXP USA Inc. |
 Description: HIGH SPEED TRANSCEIVER WITH SPIPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Function: Power Management Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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| MC33665ATS4AER2 | Hersteller : NXP Semiconductors |
Battery Management BMS Gateway IC SPI |
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