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LPC812M101FDH20FP NXP Semiconductors
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Technische Details LPC812M101FDH20FP NXP Semiconductors
Description: IC MCU 32BIT 16KB FLASH 20TSSOP, Packaging: Tube, Package / Case: 20-TSSOP (0.173", 4.40mm Width), Mounting Type: Surface Mount, Speed: 30MHz, Program Memory Size: 16KB (16K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M0+, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I²C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, Supplier Device Package: 20-TSSOP, Number of I/O: 18, DigiKey Programmable: Not Verified.
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LPC812M101FDH20FP | Hersteller : NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 18 DigiKey Programmable: Not Verified |
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