LPC55S36JBD100K NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 3x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
auf Bestellung 434 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.66 EUR |
| 10+ | 14.41 EUR |
| 25+ | 14.11 EUR |
| 40+ | 14.06 EUR |
| 80+ | 12.61 EUR |
| 230+ | 12.23 EUR |
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Technische Details LPC55S36JBD100K NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP, Packaging: Tray, Package / Case: 100-LQFP, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 128K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 23x16b; D/A 3x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Supplier Device Package: 100-HLQFP (14x14), Number of I/O: 66.
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| LPC55S36JBD100K | Hersteller : NXP |
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| LPC55S36JBD100K | Hersteller : NXP |
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