LPC5534JBD100MP NXP USA Inc.
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Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
auf Bestellung 980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.32 EUR |
10+ | 12.27 EUR |
25+ | 12.01 EUR |
50+ | 11.97 EUR |
100+ | 10.74 EUR |
250+ | 10.42 EUR |
500+ | 9.91 EUR |
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Technische Details LPC5534JBD100MP NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP, Packaging: Tape & Reel (TR), Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 128KB (128K x 8), RAM Size: 96K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 23x16b; D/A 2x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Supplier Device Package: 100-HLQFP (14x14), Number of I/O: 66.
Weitere Produktangebote LPC5534JBD100MP
Foto | Bezeichnung | Hersteller | Beschreibung |
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LPC5534JBD100MP | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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LPC5534JBD100MP | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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LPC5534JBD100MP | Hersteller : NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 23x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 66 |
Produkt ist nicht verfügbar |
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![]() |
LPC5534JBD100MP | Hersteller : NXP Semiconductors |
![]() |
Produkt ist nicht verfügbar |