Technische Details LPC2368FBD100,518 NXP Semiconductors
Description: IC MCU 16/32B 512KB FLSH 100LQFP, Packaging: Tape & Reel (TR), Part Status: Active, Package / Case: 100-LQFP, Mounting Type: Surface Mount, Supplier Device Package: 100-LQFP (14x14), Speed: 72MHz, Program Memory Size: 512KB (512K x 8), RAM Size: 58K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM7TDMI-S, Data Converters: A/D 6x10b SAR; D/A 1x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT, Number of I/O: 70, Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB.
Weitere Produktangebote LPC2368FBD100,518
Foto | Bezeichnung | Hersteller | Beschreibung |
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LPC2368FBD100,518 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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LPC2368FBD100,518 | Hersteller : NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Part Status: Active Package / Case: 100-LQFP Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14x14) Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 58K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM7TDMI-S Data Converters: A/D 6x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 70 Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB |
Produkt ist nicht verfügbar |
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LPC2368FBD100,518 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |