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LPC18S10FET100E NXP USA Inc.
![LPC18S50_30_10.pdf](/images/adobe-acrobat.png)
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 258 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.57 EUR |
10+ | 10.66 EUR |
80+ | 8.82 EUR |
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Technische Details LPC18S10FET100E NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA, Packaging: Tray, Package / Case: 100-TFBGA, Mounting Type: Surface Mount, Speed: 180MHz, RAM Size: 136K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 4x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT, Supplier Device Package: 100-TFBGA (9x9), Part Status: Active, Number of I/O: 49, DigiKey Programmable: Not Verified.
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LPC18S10FET100E | Hersteller : NXP |
![]() Description: IC: ARM microcontroller; 136kBSRAM; TFBGA100; 2.4÷3.6VDC Type of integrated circuit: ARM microcontroller Interface: CAN; I2C; SPI; UART; USART Memory: 136kB SRAM Supply voltage: 2.4...3.6V DC Mounting: SMD Operating temperature: -40...85°C Number of inputs/outputs: 49 Case: TFBGA100 Kind of architecture: Cortex M3 |
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