K32W061-DK006 NXP USA Inc.
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Description: K32W061-DK006
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
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Technische Details K32W061-DK006 NXP USA Inc.
Description: K32W061-DK006, Packaging: Bulk, Package / Case: 40-VFQFN Exposed Pad, Sensitivity: -101.3dBm, Mounting Type: Surface Mount, Frequency: 2.4GHz, Memory Size: 640kB Flash, 152kB SRAM, Type: TxRx + MCU, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 1.9V ~ 3.6V, Power - Output: 11.2dBm, Protocol: Bluetooth v5.0, Current - Receiving: 4.3mA, Data Rate (Max): 2Mbps, Current - Transmitting: 7.4mA ~ 20.3mA, Supplier Device Package: 40-HVQFN (6x6), GPIO: 22, RF Family/Standard: 802.15.4, Bluetooth, Serial Interfaces: I2C, SPI, PWM, UART.
Weitere Produktangebote K32W061-DK006
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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K32W061-DK006 | Hersteller : NXP Semiconductors |
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