ICF-308-S-O-TR Samtec
auf Bestellung 361 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 5.81 EUR |
| 10+ | 5.46 EUR |
| 100+ | 4.01 EUR |
| 450+ | 3.96 EUR |
| 900+ | 3.5 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details ICF-308-S-O-TR Samtec
Description: CONN IC DIP SOCKET 8POS TIN, Packaging: Tape & Reel (TR), Features: Open Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper.
Weitere Produktangebote ICF-308-S-O-TR nach Preis ab 5.09 EUR bis 6.35 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||
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ICF-308-S-O-TR | Hersteller : Samtec Inc. |
 Description: CONN IC DIP SOCKET 8POS TINPackaging: Cut Tape (CT) Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper |
auf Bestellung 116 Stücke: Lieferzeit 10-14 Tag (e) |
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ICF-308-S-O-TR | Hersteller : Samtec |
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R |
auf Bestellung 500 Stücke: Lieferzeit 14-21 Tag (e) |
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ICF-308-S-O-TR | Hersteller : Samtec |
Conn DIP Socket SKT 8 POS 2.54mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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ICF-308-S-O-TR | Hersteller : Samtec Inc. |
Description: CONN IC DIP SOCKET 8POS TIN Packaging: Tape & Reel (TR) Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |