HW-11-09-S-D-300-130 Samtec Inc.
Hersteller: Samtec Inc.Description: HIGH TEMPERATURE FLEXIBLE BOARD
Packaging: Bulk
Color: Black, Natural
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 22
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.300" (7.620mm)
Length - Stack Height: 0.300" (7.620mm)
Length - Tail: 0.130" (3.302mm)
auf Bestellung 269 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.85 EUR |
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Technische Details HW-11-09-S-D-300-130 Samtec Inc.
Description: HIGH TEMPERATURE FLEXIBLE BOARD, Packaging: Bulk, Color: Black, Natural, Mounting Type: Through Hole, Pitch: 0.100" (2.54mm), Row Spacing: 0.100" (2.54mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 2, Number of Positions: 22, Length - Overall Pin: 0.730" (18.542mm), Length - Post (Mating): 0.300" (7.620mm), Length - Stack Height: 0.300" (7.620mm), Length - Tail: 0.130" (3.302mm).
Weitere Produktangebote HW-11-09-S-D-300-130
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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HW-11-09-S-D-300-130 | Hersteller : Samtec |
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100" Pitch |
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