auf Bestellung 4866 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 3.24 EUR |
| 10+ | 3.22 EUR |
| 25+ | 3.1 EUR |
| 50+ | 3.04 EUR |
| 100+ | 3.01 EUR |
| 250+ | 2.99 EUR |
| 500+ | 2.94 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSS-C2540-SMT-TR CUI Devices
Description: HEAT SINK TO-263 COPPER, Packaging: Tape & Reel (TR), Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Power Dissipation @ Temperature Rise: 3.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 21.90°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote HSS-C2540-SMT-TR nach Preis ab 2.06 EUR bis 3.33 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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HSS-C2540-SMT-TR | Hersteller : Same Sky |
 Heat Sinks 19.38 x 25.4x11.43mm TO-263 SMT |
auf Bestellung 4849 Stücke: Lieferzeit 10-14 Tag (e) |
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HSS-C2540-SMT-TR | Hersteller : CUI DEVICES |
Heat Sink Passive TO-263 SMD Copper 5.5C/W Tin |
Produkt ist nicht verfügbar |
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HSS-C2540-SMT-TR | Hersteller : CUI Devices |
Description: HEAT SINK TO-263 COPPER Packaging: Tape & Reel (TR) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 21.90°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
Produkt ist nicht verfügbar |
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HSS-C2540-SMT-TR | Hersteller : CUI Devices |
Description: HEAT SINK TO-263 COPPER Packaging: Cut Tape (CT) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 21.90°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
Produkt ist nicht verfügbar |
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| HSS-C2540-SMT-TR | Hersteller : CUI Devices |
Category: Heatsinks Description: Heatsink: extruded; U; TO263; silver; L: 19.38mm; W: 25.4mm; C1100 Mounting: SMT Colour: silver Length: 19.38mm Thermal resistance: max. 21.9°C/W Type of heatsink: extruded Heatsink shape: U Material finishing: tin plated Plate thickness: 0.6mm Thermal resistance @200 LFM: 5.5°C/W Width: 25.4mm Material: C1100 Height: 11.43mm Application: TO263 |
Produkt ist nicht verfügbar |