![HSEC8-130-01-S-DV-A-WT-K HSEC8-130-01-S-DV-A-WT-K](https://download.siliconexpert.com/pdfs/2017/5/16/6/43/30/824/smt_/manual/hsec8-dv_thumb.jpg)
HSEC8-130-01-S-DV-A-WT-K Samtec
auf Bestellung 1019 Stücke:
Lieferzeit 14-21 Tag (e)
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Technische Details HSEC8-130-01-S-DV-A-WT-K Samtec
Description: CONN EDGE DUAL FMALE 60POS 0.031, Packaging: Tray, Features: Board Guide, Solder Retention, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: Non Specified - Dual Edge, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 30.0µin (0.76µm), Contact Material: Beryllium Copper, Number of Positions/Bay/Row: 30, Number of Rows: 2.
Weitere Produktangebote HSEC8-130-01-S-DV-A-WT-K nach Preis ab 9.85 EUR bis 12.25 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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HSEC8-130-01-S-DV-A-WT-K | Hersteller : Samtec Inc. |
![]() Packaging: Tray Features: Board Guide, Solder Retention Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: Non Specified - Dual Edge Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
auf Bestellung 140 Stücke: Lieferzeit 10-14 Tag (e) |
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HSEC8-130-01-S-DV-A-WT-K | Hersteller : Samtec |
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