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HSEC8-108-01-L-DP-A-K

HSEC8-108-01-L-DP-A-K Samtec Inc.


hsec8-dp.pdf Hersteller: Samtec Inc.
Description: CONN PCI EXP FMALE 16POS 0.031
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.063" (1.60mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Rows: 2
auf Bestellung 154 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.58 EUR
10+ 10.47 EUR
25+ 9.89 EUR
50+ 9.65 EUR
100+ 9.17 EUR
Mindestbestellmenge: 2
Produktrezensionen
Produktbewertung abgeben

Technische Details HSEC8-108-01-L-DP-A-K Samtec Inc.

Description: CONN PCI EXP FMALE 16POS 0.031, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 16, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.063" (1.60mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Beryllium Copper, Number of Rows: 2.

Weitere Produktangebote HSEC8-108-01-L-DP-A-K

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
HSEC8-108-01-L-DP-A-K Hersteller : Samtec hsec8_dv.pdf HSEC8-108-01-L-DP-A-K
Produkt ist nicht verfügbar
HSEC8-108-01-L-DP-A-K HSEC8-108-01-L-DP-A-K Hersteller : Samtec Inc. hsec8-dp.pdf Description: CONN PCI EXP FMALE 16POS 0.031
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.063" (1.60mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Rows: 2
Produkt ist nicht verfügbar
HSEC8-108-01-L-DP-A-K HSEC8-108-01-L-DP-A-K Hersteller : Samtec hsec8_dv-2758196.pdf Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
Produkt ist nicht verfügbar