Technische Details HEF4067BP,652 NXP Semiconductors
Description: IC MUX 16:1 155OHM 24DIP, Packaging: Tube, Package / Case: 24-DIP (0.600", 15.24mm), Mounting Type: Through Hole, Operating Temperature: -40°C ~ 85°C (TA), On-State Resistance (Max): 155Ohm, -3db Bandwidth: 70MHz, Supplier Device Package: 24-DIP, Voltage - Supply, Single (V+): 3V ~ 15V, Crosstalk: -50dB @ 1MHz, Multiplexer/Demultiplexer Circuit: 16:1, Channel-to-Channel Matching (ΔRon): 5Ohm, Channel Capacitance (CS(off), CD(off)): 7.5pF, Current - Leakage (IS(off)) (Max): 200nA, Number of Circuits: 1.
Weitere Produktangebote HEF4067BP,652
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HEF4067BP,652 | Hersteller : NXP Semiconductors |
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HEF4067BP,652 | Hersteller : NXP USA Inc. |
![]() Packaging: Tube Package / Case: 24-DIP (0.600", 15.24mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) On-State Resistance (Max): 155Ohm -3db Bandwidth: 70MHz Supplier Device Package: 24-DIP Voltage - Supply, Single (V+): 3V ~ 15V Crosstalk: -50dB @ 1MHz Multiplexer/Demultiplexer Circuit: 16:1 Channel-to-Channel Matching (ΔRon): 5Ohm Channel Capacitance (CS(off), CD(off)): 7.5pF Current - Leakage (IS(off)) (Max): 200nA Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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HEF4067BP,652 | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |