HC5517IB Harris Corporation
Hersteller: Harris Corporation
Description: RINGING SLIC FOR ISDN MODEM
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 2-Wire, 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 6mA
Supplier Device Package: 28-SOIC
Number of Circuits: 1
Power (Watts): 300 mW
Description: RINGING SLIC FOR ISDN MODEM
Packaging: Bulk
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 2-Wire, 4-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 6mA
Supplier Device Package: 28-SOIC
Number of Circuits: 1
Power (Watts): 300 mW
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
71+ | 7.06 EUR |
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Technische Details HC5517IB Harris Corporation
Description: RINGING SLIC FOR ISDN MODEM, Packaging: Bulk, Package / Case: 28-SOIC (0.295", 7.50mm Width), Mounting Type: Surface Mount, Function: Subscriber Line Interface Concept (SLIC), Interface: 2-Wire, 4-Wire, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 4.75V ~ 5.25V, Current - Supply: 6mA, Supplier Device Package: 28-SOIC, Number of Circuits: 1, Power (Watts): 300 mW.
Weitere Produktangebote HC5517IB
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
HC5517IB | Hersteller : HARRIS |
auf Bestellung 20 Stücke: Lieferzeit 21-28 Tag (e) |