FS770R08A6P2LBBPSA1 Infineon Technologies
Hersteller: Infineon Technologies
Trans IGBT Module N-CH 750V 450A 654000mW Automotive 33-Pin HYBRIDD-1 Tray
Trans IGBT Module N-CH 750V 450A 654000mW Automotive 33-Pin HYBRIDD-1 Tray
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Technische Details FS770R08A6P2LBBPSA1 Infineon Technologies
Description: HYBRID PACK DRIVE, Packaging: Tray, Package / Case: Module, Mounting Type: Chassis Mount, Input: Standard, Configuration: Three Phase Inverter, Operating Temperature: -40°C ~ 150°C (TJ), Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A, NTC Thermistor: Yes, Supplier Device Package: AG-HYBRIDD-1, IGBT Type: Trench Field Stop, Part Status: Active, Current - Collector (Ic) (Max): 450 A, Voltage - Collector Emitter Breakdown (Max): 750 V, Power - Max: 654 W, Current - Collector Cutoff (Max): 1 mA, Input Capacitance (Cies) @ Vce: 80 nF @ 50 V.
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Foto | Bezeichnung | Hersteller | Beschreibung |
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FS770R08A6P2LBBPSA1 | Hersteller : Infineon Technologies |
Description: HYBRID PACK DRIVE Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A NTC Thermistor: Yes Supplier Device Package: AG-HYBRIDD-1 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 450 A Voltage - Collector Emitter Breakdown (Max): 750 V Power - Max: 654 W Current - Collector Cutoff (Max): 1 mA Input Capacitance (Cies) @ Vce: 80 nF @ 50 V |
Produkt ist nicht verfügbar |
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FS770R08A6P2LBBPSA1 | Hersteller : Infineon Technologies | IGBT Modules HYBRID PACK DRIVE G1 SI |
Produkt ist nicht verfügbar |